Numerical Thermal Stress Analysis on Semiconductors with Nano-Fluid Coolant

Numerical Thermal Stress Analysis on Semiconductors with Nano-Fluid Coolant

Luis Medina

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Kevin Harvey

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Cory Davison

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Edgar Rubio

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Morteza Mohssenzadeh

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Hamidreza Ghasemi Bahraseman

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Taha Ghaemi Bahraseman

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Numerical Thermal Stress Analysis on Semiconductors with Nano-Fluid Coolant

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Abstract

During the course of normal operation, electrical components made from semiconducting materials undergo significant stress from heating. This causes parts to wear out more quickly or, in the more extreme cases, fail altogether. In order to maintain a stable operating temperature, many different types of cooling systems have been used. Our work investigates the best materials to use in these systems, carefully considering effectiveness, cost, and longevity in our assessment. Ansys simulation software was used to simulate the effects of different coolants on removing heat from a semiconductor. The coolants are air, water, and aluminum oxide. Though we didn’t model the results of forced convection across these materials, the natural convection heat transfer results in finding the more efficient coolant. Considering liquid cooling methods for semiconductor-based devices, the kind of fluid plays a vital role in the transfer of energy.

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Funding

No external funding was declared for this work.

Conflict of Interest

The authors declare no conflict of interest.

Ethical Approval

No ethics committee approval was required for this article type.

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Not applicable for this article.

How to Cite This Article

Luis Medina. 2026. \u201cNumerical Thermal Stress Analysis on Semiconductors with Nano-Fluid Coolant\u201d. Global Journal of Research in Engineering - A : Mechanical & Mechanics GJRE-A Volume 22 (GJRE Volume 22 Issue A2).

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GJRE Volume 22 Issue A2

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Journal Specifications

Crossref Journal DOI 10.17406/gjre

Print ISSN 0975-5861

e-ISSN 2249-4596

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GJRE-A Classification DDC Code: 519.4 LCC Code: QA297

Submission ReceivedDecember 28, 2021
Peer Review Double Blind
Handling Editor
Accepted January 22, 2022
Published February 2, 2022

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August 30, 2022

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