Thermal Stress Analysis of BGA Packaging Structure
In this paper the performance of the ball grid array (BGA) electronic packaging is investigated. The fields of temperature and stress are analyzed for the overall model & for solder balls by finite element method (FEM) using COMSOL Multiphysics 5.2a software to analyze different aspects to improve the reliability & efficiency of integrated chip. The simulation result shows that the maximum value of temperature and thermal stress are 41 degree Celsius & 199MPa respectively. The maximum temperature is obtained on the chip surface and the maximum stress happens on the outside corner of the ball joints. The range analysis shows that the maximum stress increases with the increase of chip thickness, substrate width, ball pitch, CTE but the value of maximum stress decrease with the increase of ball diameter and Poisson’s ratio.
