Effect of Parametric Variations on Electromigration in Integrated Circuits

Article ID

SFR3R22A

Effect of Parametric Variations on Electromigration in Integrated Circuits

Muhammad Sana Ullah
Muhammad Sana Ullah Florida Polytechnic University
Drew K. Tallman
Drew K. Tallman
DOI

Abstract

This research paper focuses on the effects of electromigration in integrated circuits at the anoscale domain. This is an investigative work that shows how various process and parametric variation effects on electromigration. With integrated circuits reaching in the nanoscale domain, electromigration is becoming more of a prominent problem. Being able to find changes into the integrated circuits to provide a better electromigration performance is crucial for future emerging nanotechnologies. Therefore, this paper will go through previous research work to show the evolution of Black’s equation and see if Black’s equation could use on nanoscale integrated circuits. Also, it will be showing future iterations of the equation and comparing them with constant variables. Besides, a comparison of aluminum and copper interconnects and how electromigration happens differently are also discussing in this paper. Then a conclusion on how Black’s equation could use with nanoscale technologies to predict the time during the occurrence of electromigration.

Effect of Parametric Variations on Electromigration in Integrated Circuits

This research paper focuses on the effects of electromigration in integrated circuits at the anoscale domain. This is an investigative work that shows how various process and parametric variation effects on electromigration. With integrated circuits reaching in the nanoscale domain, electromigration is becoming more of a prominent problem. Being able to find changes into the integrated circuits to provide a better electromigration performance is crucial for future emerging nanotechnologies. Therefore, this paper will go through previous research work to show the evolution of Black’s equation and see if Black’s equation could use on nanoscale integrated circuits. Also, it will be showing future iterations of the equation and comparing them with constant variables. Besides, a comparison of aluminum and copper interconnects and how electromigration happens differently are also discussing in this paper. Then a conclusion on how Black’s equation could use with nanoscale technologies to predict the time during the occurrence of electromigration.

Muhammad Sana Ullah
Muhammad Sana Ullah Florida Polytechnic University
Drew K. Tallman
Drew K. Tallman

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Muhammad Sana Ullah. 2018. “. Global Journal of Science Frontier Research – A: Physics & Space Science GJSFR-A Volume 18 (GJSFR Volume 18 Issue A9): .

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Journal Specifications

Crossref Journal DOI 10.17406/GJSFR

Print ISSN 0975-5896

e-ISSN 2249-4626

Issue Cover
GJSFR Volume 18 Issue A9
Pg. 31- 36
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GJSFR-A Classification: FOR Code: 090604
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Effect of Parametric Variations on Electromigration in Integrated Circuits

Muhammad Sana Ullah
Muhammad Sana Ullah Florida Polytechnic University
Drew K. Tallman
Drew K. Tallman

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