Article Fingerprint
ReserarchID
X911C
Prof. D.V.Mahindru. 2013. \u201cHigh Temperature Adhesive: Eccobond-104\u201d. Global Journal of Research in Engineering - F: Electrical & Electronic GJRE-F Volume 13 (GJRE Volume 13 Issue F14).
Crossref Journal DOI 10.17406/gjre
Print ISSN 0975-5861
e-ISSN 2249-4596
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Total Score: 108
Country: Unknown
Subject: Global Journal of Research in Engineering - F: Electrical & Electronic
Authors: Prof. Priyanka Mahendru, Asstt. Professor (E&C) ,Prof. D.V.Mahindru F.I.E. , Professor (Mech. Engg.) ,Prof. Priyanka Mahendru, Asstt. Professor (E&C) ,SRMGPC,Lucknow-227105 U.P. (India) (PhD/Dr. count: 0)
View Count (all-time): 226
Total Views (Real + Logic): 4756
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Publish Date: 2013 11, Sat
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This study aims to comprehensively analyse the complex interplay between
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