A Distributed-Ledger, Edge-Computing Architecture for Automation and Computer Integration in Semiconductor Manufacturing

Da-Yin Liao

A Distributed-Ledger, Edge-Computing Architecture for Automation and Computer Integration in Semiconductor Manufacturing

Da-Yin Liao * §

Contact

§ Straight & Up Intelligent Innovations Group Co

A Distributed-Ledger, Edge-Computing Architecture for Automation and Computer Integration in Semiconductor Manufacturing

Article Fingerprint

ReserarchID

CST9QLLW

A Distributed-Ledger, Edge-Computing Architecture for Automation and Computer Integration in Semiconductor Manufacturing Banner

Key Research Insights

Synthesized scholarly intelligence & interactive research assistant

Abstract

Contemporary 300mm semiconductor manufacturing systems have highly automated and digitalized cyber-physical integration. They suffer from the profound problems of integrating large, centralized legacy systems with small islands of automation. With the recent advances in disruptive technologies, semiconductor manufacturing has faced dramatic pressures to reengineer its automation and computer integrated systems. This paper proposes a Distributed-Ledger, Edge-Computing Architecture (DLECA) for automation and computer integration in semiconductor manufacturing. Based on distributed ledger and edge computing technologies, DLECA establishes a decentralized software framework where manufacturing data are stored in distributed ledgers and processed locally by executing smart contracts at the edge nodes. We adopt an important topic of automation and computer integration for semiconductor research & development (R&D) operations as the study vehicle to illustrate the operational structure and functionality, applications, and feasibility of the proposed DLECA software framework.

References

46 Cites in Article

Reference Format

Mario Hermann,Tobias Pentek,Boris Otto (2016). Design Principles for Industrie 4.0 Scenarios.
K Thoben,S Wiesner,T Wuest (2017). Industrie 4.0" and smart manufacturing-a review of research issues and application examples.
A Kusiak (2018). Smart manufacturing.
P Van Zant (2013). Semiconductor Photonic Devices.
Gary May,Costas Spanos (2006). Fundamentals of Semiconductor Manufacturing and Process Control.
K Gartland,S Kono (1999). Automated Material Handling System (AMHS) Framework User Requirements Document: Version 1.
D Liao,H Fu (2004). Speedy deliverydynamic OHT allocation and dispatching in largescale, 300-mm AMHS management.
D Liao,C Wang (2004). Neural-networkbased delivery time estimates for prioritized 300-mm automatic material handling operations.
Da-Yin Liao (2010). Automation and Integration in Semiconductor Manufacturing.
Kwangok Jeong,Andrew Kahng (2015). A power-constrained MPU roadmap for the International Technology Roadmap for Semiconductors (ITRS).
J Hawker (1998). CIM Framework architecture and application models.
D Doscher (1998). Computer integrated manufacturing (CIM) framework specification version 2.0.
Thomas Hedberg,Moneer Helu,Timothy Sprock (2018). A Standards and Technology Roadmap for Scalable Distributed Manufacturing Systems.
Nabil El Ioini,Claus Pahl (2018). A Review of Distributed Ledger Technologies.
M Swan (2015). Blockchain: Blueprint for A New Economy.
Michael Nofer,Peter Gomber,Oliver Hinz,Dirk Schiereck (2017). Blockchain.
Jameela Al-Jaroodi,Nader Mohamed (2019). Blockchain in Industries: A Survey.
Nick Szabo (1997). Formalizing and Securing Relationships on Public Networks.
Weisong Shi,Jie Cao,Quan Zhang,Youhuizi Li,Lanyu Xu (2016). Edge Computing: Vision and Challenges.
J Mcgehee,J Hebley,J Mahaffey (1994). The MMST computer-integrated manufacturing system framework.
(1997). Computer Integrated Manufacturing (CIM) Framework Specification.
F Cheng,E Shen,J Deng,K Nguyen (1999). Development of a system framework for the system: a distributed object-oriented approach.
V Devedžić,D Radović (1999). A framework for building intelligent manufacturing systems.
C Lin,M Jeng (2005). An expanded SEMATECH CIM framework for heterogeneous applications integration.
Tae-Eog Lee (2009). Semiconductor Manufacturing Automation.
B Saenz De Ugarte,A Artiba,R Pellerin (2009). Manufacturing execution system-a literature review.
Timothy Sprock,Michael Sharp,William Bernstein,Michael Brundage,Moneer Helu,Thomas Hedberg (2019). Integrated Operations Management for Distributed Manufacturing.
P Vrba,P Tichý,V Mařík,K Hall,R Staron,F Maturana,P Kadera (2010). Rockwell automation's holonic and multiagent control systems compendium.
G Chryssolouris,D Mavrikios,N Papakostas,D Mourtzis,G Michalos,K Georgoulias (2009). Digital manufacturing: History, perspectives, and outlook.
Efe Balta,Yikai Lin,Kira Barton,Dawn Tilbury,Z Mao (2018). Production as a Service: A Digital Manufacturing Framework for Optimizing Utilization.
Aleksey Bratukhin,Thilo Sauter (2011). Functional Analysis of Manufacturing Execution System Distribution.
V Vyatkin (2007). IEC 61499 Function Blocks For Embedded and Distributed Control Systems Design.
Alois Zoitl,Robert Lewis (2014). Modelling Control Systems Using IEC 61499.
M Foehr,J Vollmar,A Calà,P Leitão,S Karnouskos,A Colombo (2017). Engineering of next generation cyber-physical automation system architectures.
M Dotoli,A Fay,M Miśkowicz,C Seatzu (2019). An overview of current technologies and emerging trends in factory automation.
N El Ioini,C Pahl (2018). A review of distributed ledger technologies.
M Iansiti,K Lakhani (2017). The truth about blockchain.
S Nakamoto (2008). A peer-to-peer electronic cash system.
V Buterin (2014). A next-generation smart contract and decentralized application platform.
Tiago Fernandez-Carames,Paula Fraga-Lamas (2019). A Review on the Application of Blockchain to the Next Generation of Cybersecure Industry 4.0 Smart Factories.
Ameer Khan,Xinwei Cao,Shuai Li,Zoran Milosevic (2019). Blockchain Technology with Applications to Distributed Control and Cooperative Robotics: A Survey.
A Stanciu (2017). Blockchain based distributed control system for edge computing.
M Isaja,J Soldatos,V Gezer (2017). Combining edge computing and blockchains for flexibility and performance in industrial automation.
Mauro Isaja,John Soldatos (2018). Distributed Ledger Architecture for Automation, Analytics and Simulation in Industrial Environments.
D Liao,S Chang,K Pei,C Chang (1996). Daily scheduling for R&D semiconductor fabrication.
Haga Makoto (1997). Machining program execution method for an NC device.

Download References

Funding

No external funding was declared for this work.

Conflict of Interest

The authors declare no conflict of interest.

Ethical Approval

No ethics committee approval was required for this article type.

Data Availability

Not applicable for this article.

How to Cite This Article

Da-Yin Liao. 2020. "A Distributed-Ledger, Edge-Computing Architecture for Automation and Computer Integration in Semiconductor Manufacturing". Global Journal of Computer Science and Technology - G: Interdisciplinary GJCST-G Volume 20 (GJCST Volume 20 Issue G3).

More Citation Formats

Select Citation Style:

Download Citation

GJCST Volume 20 Issue G3

Explore Journals Explore Volume Read This Issue

Journal Specifications

Crossref Journal DOI 10.17406/gjcst

Print ISSN 0975-4350

e-ISSN 0975-4172

Keywords

Not Found

Classification

GJCST-G Classification C.2.4

Submission ReceivedDecember 14, 2019
Peer Review Double Blind
Handling Editor
Accepted January 1, 2020
Published January 15, 2020

Version of record

v1.2

Issue date

April 27, 2020

Language

English

Experiance in AR

Explore published articles in an immersive Augmented Reality environment. Our platform converts research papers into interactive 3D books, allowing readers to view and interact with content using AR and VR compatible devices.

View in VR

Read in 3D

Your published article is automatically converted into a realistic 3D book. Flip through pages and read research papers in a more engaging and interactive format.

View in 3D

Article Matrices

Total Views: 1.1K

Total Downloads: 56

All Trends