Numerical Thermal Stress Analysis on Semiconductors with Nano-Fluid Coolant

1
Luis Medina
Luis Medina
2
Kevin Harvey
Kevin Harvey
3
Cory Davison
Cory Davison
4
Edgar Rubio
Edgar Rubio
5
Morteza Mohssenzadeh
Morteza Mohssenzadeh
6
Hamidreza Ghasemi Bahraseman
Hamidreza Ghasemi Bahraseman
7
Taha Ghaemi Bahraseman
Taha Ghaemi Bahraseman

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During the course of normal operation, electrical components made from semiconducting materials undergo significant stress from heating. This causes parts to wear out more quickly or, in the more extreme cases, fail altogether. In order to maintain a stable operating temperature, many different types of cooling systems have been used. Our work investigates the best materials to use in these systems, carefully considering effectiveness, cost, and longevity in our assessment. Ansys simulation software was used to simulate the effects of different coolants on removing heat from a semiconductor. The coolants are air, water, and aluminum oxide. Though we didn’t model the results of forced convection across these materials, the natural convection heat transfer results in finding the more efficient coolant. Considering liquid cooling methods for semiconductor-based devices, the kind of fluid plays a vital role in the transfer of energy.

Funding

No external funding was declared for this work.

Conflict of Interest

The authors declare no conflict of interest.

Ethical Approval

No ethics committee approval was required for this article type.

Data Availability

Not applicable for this article.

Luis Medina. 2026. \u201cNumerical Thermal Stress Analysis on Semiconductors with Nano-Fluid Coolant\u201d. Global Journal of Research in Engineering - A : Mechanical & Mechanics GJRE-A Volume 22 (GJRE Volume 22 Issue A2): .

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High-resolution thermal analysis for nanofluid semiconductors.
Journal Specifications

Crossref Journal DOI 10.17406/gjre

Print ISSN 0975-5861

e-ISSN 2249-4596

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GJRE-A Classification: DDC Code: 519.4 LCC Code: QA297
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v1.2

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August 30, 2022

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English

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During the course of normal operation, electrical components made from semiconducting materials undergo significant stress from heating. This causes parts to wear out more quickly or, in the more extreme cases, fail altogether. In order to maintain a stable operating temperature, many different types of cooling systems have been used. Our work investigates the best materials to use in these systems, carefully considering effectiveness, cost, and longevity in our assessment. Ansys simulation software was used to simulate the effects of different coolants on removing heat from a semiconductor. The coolants are air, water, and aluminum oxide. Though we didn’t model the results of forced convection across these materials, the natural convection heat transfer results in finding the more efficient coolant. Considering liquid cooling methods for semiconductor-based devices, the kind of fluid plays a vital role in the transfer of energy.

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Numerical Thermal Stress Analysis on Semiconductors with Nano-Fluid Coolant

Luis Medina
Luis Medina
Kevin Harvey
Kevin Harvey
Cory Davison
Cory Davison
Edgar Rubio
Edgar Rubio
Morteza Mohssenzadeh
Morteza Mohssenzadeh
Hamidreza Ghasemi Bahraseman
Hamidreza Ghasemi Bahraseman
Taha Ghaemi Bahraseman
Taha Ghaemi Bahraseman

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