Stresses Relaxation Mechanism in the Si-SiO2 System and its Influence on the Interface Properties

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Daniel Kropman
Daniel Kropman
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TAnu Laas
TAnu Laas
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Viktor Seeman
Viktor Seeman
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Artur Medvids
Artur Medvids
α Tallinn University Tallinn University

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Stresses Relaxation Mechanism in the Si-SiO2 System and its Influence on the Interface Properties

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Abstract

The results of the investigation of stresses relaxation by strain by means of EPR spectra, IR absorption spectra, SEM and samples deflection are presented. It has been shown that stresses relaxation mechanism depended on the oxidation condition: temperature, cooling rate, oxide thickness. In the Si-SiO 2 -Si 3 N 4 system the stresses relaxation by the strain occur due to the opposite sign of the thermal expansion coefficient of Si-SiO 2 and Si 3 N 4 on Si. Laser irradiation allows to modify the system stresses.

References

4 Cites in Article
  1. D Kropman,V Poll,T Kärner,Ü Ugaste,E Mellikov,U Abru,V Paomets (2003). Investigation of the strain relaxation mechanism in the Si–SiO2 system during the process of its formation.
  2. T Tan,U Gösele (1985). Unknown Title.
  3. D Kropman,S Dolgov,T Kärner (1996). On the kinetics of the generation of point defects in the Si-SiO 2 system.
  4. D Wolters,A. T. A. Zegers-Van Duijnhoven (1993). Thermal oxidation of silicon and residual fixed charge.

Funding

No external funding was declared for this work.

Conflict of Interest

The authors declare no conflict of interest.

Ethical Approval

No ethics committee approval was required for this article type.

Data Availability

Not applicable for this article.

How to Cite This Article

Daniel Kropman. 2017. \u201cStresses Relaxation Mechanism in the Si-SiO2 System and its Influence on the Interface Properties\u201d. Global Journal of Science Frontier Research - B: Chemistry GJSFR-B Volume 17 (GJSFR Volume 17 Issue B1): .

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Journal Specifications

Crossref Journal DOI 10.17406/GJSFR

Print ISSN 0975-5896

e-ISSN 2249-4626

Keywords
Classification
GJSFR-B Classification: FOR Code: 030599
Version of record

v1.2

Issue date

May 30, 2017

Language
en
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The results of the investigation of stresses relaxation by strain by means of EPR spectra, IR absorption spectra, SEM and samples deflection are presented. It has been shown that stresses relaxation mechanism depended on the oxidation condition: temperature, cooling rate, oxide thickness. In the Si-SiO 2 -Si 3 N 4 system the stresses relaxation by the strain occur due to the opposite sign of the thermal expansion coefficient of Si-SiO 2 and Si 3 N 4 on Si. Laser irradiation allows to modify the system stresses.

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Stresses Relaxation Mechanism in the Si-SiO2 System and its Influence on the Interface Properties

Daniel Kropman
Daniel Kropman Tallinn University
TAnu Laas
TAnu Laas
Viktor Seeman
Viktor Seeman
Artur Medvids
Artur Medvids

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