Thermal Effect in Underfill Encapsulation of Ball Grid Array

Thermal Effect in Underfill Encapsulation of Ball Grid Array

Aizat Abas

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Fei Chong Ng

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MHH Ishak

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MZ Abdullah

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Universiti Sains Malaysia

Thermal Effect in Underfill Encapsulation of Ball Grid Array

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Abstract

Current trend in the industry has seen multi-stacks ball grid array (BGA) being introduced to fulfill the increasing demands of the customer to includes both high performance and smaller size chip package. Conventional underfill encapsulation process on multi-stack BGA to to enhance the reliability of the package is still prone to undesired drawbacks of prolonged encapsulation time and incomplete filling. Accordingly, thermal energy is introduced by preheating the chip prior the underfill process is seen as a viable option to solve the slow filling time issue. A comparative experimental study is conducted on a scaled-up multi-stack BGA model for the cases at two distinct setups; at room temperature of 25°C and pre-heated at 70°C respectively. Decisive data has concluded that the setup with elevated temperature has prominently increase the filling rate by 75.2% with shorter completion filling time achieved. This justified the necessity of conducting the underfill process at an elevated temperature as a future operating procedure in the encapsulation process.

References

13 Cites in Article

Reference Format

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Funding

No external funding was declared for this work.

Conflict of Interest

The authors declare no conflict of interest.

Ethical Approval

No ethics committee approval was required for this article type.

Data Availability

Not applicable for this article.

How to Cite This Article

Aizat Abas. 2017. \u201cThermal Effect in Underfill Encapsulation of Ball Grid Array\u201d. Global Journal of Research in Engineering - F: Electrical & Electronic GJRE-F Volume 16 (GJRE Volume 16 Issue F7).

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GJRE Volume 16 Issue F7

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Journal Specifications

Crossref Journal DOI 10.17406/gjre

Print ISSN 0975-5861

e-ISSN 2249-4596

Keywords

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Classification

GJRE-F Classification FOR Code: 850505

Submission ReceivedDecember 9, 2015
Peer Review Double Blind
Handling Editor
Accepted January 3, 2016
Published January 15, 2016

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v1.2

Issue date

January 2, 2017

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Article Matrices

Total Score: 104

Country: Malaysia

Subject: Global Journal of Research in Engineering - F: Electrical & Electronic

Authors: Fei Chong Ng, Aizat Abas, MHH Ishak, MZ Abdullah (PhD/Dr. count: 0)

View Count (all-time): 230

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Publish Date: 2017 01, Mon

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Total Views: 3467

Total Downloads: 1747

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