Thermal Stress Analysis of BGA Packaging Structure

Thermal Stress Analysis of BGA Packaging Structure

Tasneem Khan Shifa

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Dr. Md. Faruque Hossain

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α Khulna University of Engineering and Technology

Thermal Stress Analysis of BGA Packaging Structure

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Abstract

In this paper the performance of the ball grid array (BGA) electronic packaging is investigated. The fields of temperature and stress are analyzed for the overall model &for solder balls by finite element method (FEM) usingCOMSOL Multiphysics 5.2a soft ware to analyze different aspects to improve the reliability & efficiency of integrated chip. The simulation result shows that the maximum value of temperature and thermal stress are 41 degree Celsius &199MParespectively.The maximum temperature is obtained on the chip surface and the maximum stress happens on the outside corner of the ball joints. The range analysis shows that the maximum stress increases with the increase of chip thickness, substrate width, ball pitch, CTE but the value of maximum stress decrease with the increase of ball diameter and Poisson’s ratio.

References

14 Cites in Article

Reference Format

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Funding

No external funding was declared for this work.

Conflict of Interest

The authors declare no conflict of interest.

Ethical Approval

No ethics committee approval was required for this article type.

Data Availability

Not applicable for this article.

How to Cite This Article

Tasneem Khan Shifa. 2018. \u201cThermal Stress Analysis of BGA Packaging Structure\u201d. Global Journal of Research in Engineering - F: Electrical & Electronic GJRE-F Volume 18 (GJRE Volume 18 Issue F3): .

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GJRE Volume 18 Issue F3
Pg. 43- 49

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Journal Specifications

Crossref Journal DOI 10.17406/gjre

Print ISSN 0975-5861

e-ISSN 2249-4596

Keywords

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Classification

GJRE-F Classification: FOR Code: 290903p

Submission ReceivedDecember 8, 2017
Peer Review Double Blind
Handling Editor
Accepted January 1, 2018
Published January 15, 2018

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Issue date

July 9, 2018

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Article Matrices

Total Score: 107

Country: Bangladesh

Subject: Global Journal of Research in Engineering - F: Electrical & Electronic

Authors: Tasneem Khan Shifa, Dr. Md. Faruque Hossain (PhD/Dr. count: 1)

View Count (all-time): 202

Total Views (Real + Logic): 3260

Total Downloads (simulated): 1616

Publish Date: 2018 07, Mon

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Total Views: 3260

Total Downloads: 1616

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