Research
Planar and Angular Modified Substrate Integrated Waveguide (SIW) Filter with Electromagnetic Bandgap(EBG) Structures
Designing of 180o linear full mode substrate integrated waveguide(FMSIW) filter and a new type of FMSIW filter bent with 90o angle have been proposed in this paper with a new type of Electromagnetic bandgap structure, etched on the PEC surface (upper layer) of the main structures to obtain the bandpass characteristics. Insertion loss is effectively low for both (180o FMSIW and 90o bent FMSIW) filters due to this distinct type of EBG structures. Outcomes of Parametric analysis of the EBG structures have also been studied and presented in graphical form. Entire experiments have been done with Neltec (NH-9320), the dielectric constant of 3.2 and thickness of 0.8 mm. Proposed filters in this paper are used for microwave Ku band applications. Both bandpass filters are compact in size, low in cost and easy to fabricate. Moreover, 90o bent filters are more convenient in use where the linear filters are restricted
Ku-band Substrate Integrated Waveguide (SIW) Slot Array Antenna for Next Generation Networks
The design of an antenna based on Substrate Integrated Waveguide (SIW) has been realized in this paper. The structure consists of an array of slot antenna designed to operate in Kuband applications. The effect of introducing arrays of slots has been extensively studied unlike any other recent publications in this field. The basic structure has been designed over a dielectric substrate with dielectric constant of 3.2 and with a thickness of 0.782mm. The design consists of a SIW antenna fed with a microstrip to SIW transition. Multiple slot array effects have been studied and analyzed using CST Microwave Studio full wave EM Simulator which supports Finite Element Method (FEM) of computational Electromagnetics. The design has been supported with its return loss and radiation pattern characteristics to validate Ku-band operation. The effect of increasing the number of slot arrays has also been analyzed to support integration to System-on- Substrate (SoS) which promises more compact layouts.
