Test and Research of Silicon Materials in Integrated device Engineering

Test and Research of Silicon Materials in Integrated device Engineering

Chuan-Zheng Yang

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1 Shanghai University

Test and Research of Silicon Materials in Integrated device Engineering

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SFR34XE2

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Abstract

It is of great practical significance to test and analyze the quality of silicon materials used in integrated devices and their changes in planar thermal process. This paper summarizes the international test, analysis and research results. The contents include polycrystal preparation, single crystal growth and its crystal defects, wafer cutting, grinding and polishing, wafer tracking observation and analysis in plane thermal process, generation control and elimination of induced dislocations, etc.

43 Cites in Articles

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Funding

No external funding was declared for this work.

Conflict of Interest

The authors declare no conflict of interest.

Ethical Approval

No ethics committee approval was required for this article type.

Data Availability

Not applicable for this article.

Chuan-Zheng Yang. 2026. \u201cTest and Research of Silicon Materials in Integrated device Engineering\u201d. Global Journal of Science Frontier Research - A: Physics & Space Science GJSFR-A Volume 23 (GJSFR Volume 23 Issue A4): .

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GJSFR Volume 23 Issue A4
Pg. 59- 87

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Journal Specifications

Crossref Journal DOI 10.17406/GJSFR

Print ISSN 0975-5896

e-ISSN 2249-4626

Keywords

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Classification

GJSFR-A Classification: LCC: TK7871.15.S5

Submission ReceivedApril 25, 2023
Peer Review Double Blind
Handling Editor
Accepted May 5, 2023
Published January 23, 2026

Version of record

v1.2

Issue date

July 11, 2023

Language

English

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